The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7710582 B1

PDF
Full Text
Expired
Date of Patent:
May. 04, 2010

Filed:

Oct. 26, 2005
Applicants:

Norihisa Koga, Kikuchi-gun, JP;

Shinji Koga, Kikuchi-gun, JP;

Naoto Yoshitaka, Kikuchi-gun, JP;

Akira Nishiya, Kikuchi-gun, JP;

Inventors:

Norihisa Koga, Kikuchi-gun, JP;

Shinji Koga, Kikuchi-gun, JP;

Naoto Yoshitaka, Kikuchi-gun, JP;

Akira Nishiya, Kikuchi-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

Before applying a processing laser beam to a surface of a substrate through a film of liquid, distance Mbetween a reference point on an axis of a first laser displacement meter and the surface of the substrate is measured to correct distance Mbetween a lower end of an optical unit and the surface of the substrate, on the basis of distance M, the processing laser beam is applied to the surface of the substrate, thereby cutting and removing a part of the surface of the substrate, and a depth to which the surface of the substrate has been cut and removed with the processing laser beam is measured by a second laser displacement meter.


Find Patent Forward Citations

Koga, Norihisa. (2010). Laser processing apparatus and laser processing method for cutting and removing a part of a surface region of a substrate (U.S. Patent No. 7710582). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7710582

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