The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

Sep. 29, 2008
Applicants:

Sanka Ganesan, Chandler, AZ (US);

Kemal Aygun, Chandler, AZ (US);

Chandrashekhar Ramaswamy, Chandler, AZ (US);

Eric Palmer, Tempe, AZ (US);

Henning Braunisch, Chandler, AZ (US);

Inventors:

Sanka Ganesan, Chandler, AZ (US);

Kemal Aygun, Chandler, AZ (US);

Chandrashekhar Ramaswamy, Chandler, AZ (US);

Eric Palmer, Tempe, AZ (US);

Henning Braunisch, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/495 (2006.01); H01L 23/10 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die-side and the I/O trace to couple with an IC device to be disposed inside the IHS footprint. The I/O trace includes a pin-out terminal outside the IHS footprint to couple to an IC device to be disposed outside the IHS footprint. The high-speed I/O trace can sustain a data flow rate from a processor in a range from 5 gigabits per second (Gb/s) to 40 Gb/s.


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