The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2010

Filed:

Dec. 08, 2005
Applicants:

Huang Liu, Singapore, SG;

Bei Chao Zhang, Singapore, SG;

Wuping Liu, Singapore, SG;

John Leonard Sudijono, Singapore, SG;

Liang Choo Hsia, Singapore, SG;

Inventors:

Huang Liu, Singapore, SG;

Bei Chao Zhang, Singapore, SG;

Wuping Liu, Singapore, SG;

John Leonard Sudijono, Singapore, SG;

Liang Choo Hsia, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An example embodiment is a method of curing a film over a semiconductor structure. We provide a semiconductor structure comprised of a substrate and an interconnect structure. We provide a film over the semiconductor structure. We provide an electron source, an anode grid between the electron source and the semiconductor structure. We cure the film by exposing the film to an electron beam from the electron source that passes through the anode grid. We control the electron beam by controlling the bias voltage between the anode grid and the semiconductor structure. Another embodiment is a tool for curing a film.


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