The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Jun. 17, 2004
Tetsuji Togawa, Tokyo, JP;
Koichi Fukaya, Tokyo, JP;
Mitsuo Tada, Tokyo, JP;
Taro Takahashi, Tokyo, JP;
Yasunari Suto, Tokyo, JP;
Tetsuji Togawa, Tokyo, JP;
Koichi Fukaya, Tokyo, JP;
Mitsuo Tada, Tokyo, JP;
Taro Takahashi, Tokyo, JP;
Yasunari Suto, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table () having a polishing surface (), a substrate holder () for holding and pressing a substrate (W) against the polishing surface () of the polishing table (), and a film thickness measuring device () for measuring a thickness of a film on the substrate (W). The substrate holder () has a plurality of pressure adjustable chambers (to), and pressures in the respective chambers (to) are adjusted based on the film thickness measured by the film thickness measuring device ().