The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2010
Filed:
Jun. 06, 2007
Cheng-chung Chen, Taipei, TW;
Chia-chung Wang, Hsinchu, TW;
Chin Hock Tan, Singapore, SG;
Charles W. C. Lin, Taipei County, TW;
Cheng-Chung Chen, Taipei, TW;
Chia-Chung Wang, Hsinchu, TW;
Chin Hock Tan, Singapore, SG;
Charles W. C. Lin, Taipei County, TW;
Bridge Semiconductor Corporation, Taipei, TW;
Abstract
The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder and the interconnect board, the metal pins having at least one end disposes on the semiconductor package, wherein when a plurality of the stackable semiconductor packages are stacked together, the exposed end of the corresponding conducting pins are bonded together. A method of manufacturing the same is also provided.