The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2010
Filed:
Oct. 11, 2005
Chen-hua Yu, Hsin-Chu, TW;
Shwang-ming Jeng, Hsin-Chu, TW;
Yung-cheng LU, Taipei, TW;
Huilin Chang, Hsin-Chu, TW;
Ting-yu Shen, Nantou, TW;
Yichi Liao, Nantou, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Shwang-Ming Jeng, Hsin-Chu, TW;
Yung-Cheng Lu, Taipei, TW;
Huilin Chang, Hsin-Chu, TW;
Ting-Yu Shen, Nantou, TW;
Yichi Liao, Nantou, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
Bond pads for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.