The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2009

Filed:

Mar. 10, 2004
Applicants:

Jason Reid, San Jose, CA (US);

Nigel Hackera, Espoo, FI;

Nina Pirilä, Espoo, FI;

Juha Rantala, Espoo, FI;

William Mclaughlin, Espoo, FI;

Inventors:

Jason Reid, San Jose, CA (US);

Nigel Hackera, Espoo, FI;

Nina Pirilä, Espoo, FI;

Juha Rantala, Espoo, FI;

William McLaughlin, Espoo, FI;

Assignee:

Silecs Oy, Espoo, FI;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/469 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a low dielectric constant structure. The method comprises providing at a first temperature a dielectric material having a first dielectric constant and a first elastic modulus, and curing the dielectric material by a thermal curing process, in which the material is heated to a second temperature by increasing the temperature at an average rate of at least 1° C. per second. As a result a densified, dielectric material is obtained which has a low dielectric constant.


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