The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Dec. 03, 2002
Noriaki Tateno, Fukuoka, JP;
Jun Miyaji, Fukuoka, JP;
Yasumi Sago, Tokyo, JP;
Masayoshi Ikeda, Tokyo, JP;
Kazuaki Kaneko, Tokyo, JP;
Tomio Takamura, Yamaguchi, JP;
Tadashi Hirayama, Yamaguchi, JP;
Yoshiyuki Ikemura, Yamaguchi, JP;
Masahiko Tamaru, Yamaguchi, JP;
Noriaki Tateno, Fukuoka, JP;
Jun Miyaji, Fukuoka, JP;
Yasumi Sago, Tokyo, JP;
Masayoshi Ikeda, Tokyo, JP;
Kazuaki Kaneko, Tokyo, JP;
Tomio Takamura, Yamaguchi, JP;
Tadashi Hirayama, Yamaguchi, JP;
Yoshiyuki Ikemura, Yamaguchi, JP;
Masahiko Tamaru, Yamaguchi, JP;
Toto Ltd., Tokyo, JP;
Canon Anelva Corporation, Tokyo, JP;
Abstract
An electrostatic chuck module for a semiconductor manufacturing apparatus which can be cooled with water and in which there is no penetration leak includes an electrostatic chuck plate of alumina and a cooling plate which is bonded to the electrostatic chuck, wherein the cooling plate is formed by forging processing to a Cu-based composite material comprising Cu—W, Cu—W—Ni, Cu—Mo, or Cu—Mo—Ni. By adjusting the ratio of Cu and Ni having a great thermal expansion coefficient and W and Mo having a small thermal expansion coefficient in a Cu-based composite material, it is possible to obtain a highly thermally conductive material having the same thermal expansion coefficient as an alumina material for an electrostatic chuck. However, since such a composite material has a penetration leak, it cannot be used in a vacuum system. According to the present invention, by conducting forging processing, a penetration leak can be prevented. Also, corrosion resistance which is important for a cooling plate can be improved by applying a Ni, Cr or Cu film by plating or sputtering.