The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2009
Filed:
Jun. 08, 2007
Applicants:
Chih-chin Liao, Changhua, TW;
Ning YE, San Jose, CA (US);
Cheemen Yu, Madison, WI (US);
Jack Chang Chien, Koashiung, TW;
Hem Takiar, Fremont, CA (US);
Inventors:
Chih-Chin Liao, Changhua, TW;
Ning Ye, San Jose, CA (US);
Cheemen Yu, Madison, WI (US);
Jack Chang Chien, Koashiung, TW;
Hem Takiar, Fremont, CA (US);
Assignee:
SanDisk Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/332 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.