The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2009

Filed:

Mar. 26, 2004
Applicants:

Kousuke Yoshihara, Kikuchi-gun, JP;

Yuichi Terashita, Kikuchi-gun, JP;

Momoko Shizukuishi, Tokyo, JP;

Atsushi Ookouchi, Kikuchi-gun, JP;

Hideharu Kyouda, Kukuchi-gun, JP;

Inventors:

Kousuke Yoshihara, Kikuchi-gun, JP;

Yuichi Terashita, Kikuchi-gun, JP;

Momoko Shizukuishi, Tokyo, JP;

Atsushi Ookouchi, Kikuchi-gun, JP;

Hideharu Kyouda, Kukuchi-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01); F26B 19/00 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat processing device that bakes a substrate having a resist coating film containing a volatile substance, includes a hot plate, a hot plate temperature control unit, a box memberthat defines a heat spaceand a fluid space, air supply unitA and suction unitA that create an air current flowing in a horizontal direction in the fluid space, and a controllerA that controls the hot plate temperature control unit, the air supply unitA, suction unitA and the gas temperature control unitso that a relationship of TF<TH≦TS≦TP is satisfied where TP represents a temperature of the hot plate, TS represents an upper surface temperature of the substrate W, TH represents a temperature of the heat space and TF represents a temperature of the fluid space.


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