The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Mar. 22, 2007
Mitsuhiko Shirakashi, Tokyo, JP;
Masayuki Kumekawa, San Jose, CA (US);
Hozumi Yasuda, Tokyo, JP;
Itsuki Kobata, Tokyo, JP;
Ikutaro Noji, Tokyo, JP;
Kaori Yoshida, Tokyo, JP;
Mitsuhiko Shirakashi, Tokyo, JP;
Masayuki Kumekawa, San Jose, CA (US);
Hozumi Yasuda, Tokyo, JP;
Itsuki Kobata, Tokyo, JP;
Ikutaro Noji, Tokyo, JP;
Kaori Yoshida, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.