The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Dec. 23, 2003
John M. DE Larios, Santa Clara, CA (US);
Mike Ravkin, Santa Clara, CA (US);
Jeffrey Farber, Delmar, NY (US);
Mikhail Korolik, San Jose, CA (US);
Fritz Redeker, Fremont, CA (US);
Aleksander Owczarz, San Jose, CA (US);
John M. de Larios, Santa Clara, CA (US);
Mike Ravkin, Santa Clara, CA (US);
Jeffrey Farber, Delmar, NY (US);
Mikhail Korolik, San Jose, CA (US);
Fritz Redeker, Fremont, CA (US);
Aleksander Owczarz, San Jose, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer, such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer, is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.