The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7563658 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 21, 2009

Filed:

Dec. 22, 2005
Applicants:

Akihiro Ishizuka, Kanagawa, JP;

Satoru Okamoto, Kanagawa, JP;

Shigeharu Monoe, Tochigi, JP;

Shunpei Yamazaki, Tokyo, JP;

Inventors:

Akihiro Ishizuka, Kanagawa, JP;

Satoru Okamoto, Kanagawa, JP;

Shigeharu Monoe, Tochigi, JP;

Shunpei Yamazaki, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a method for manufacturing a semiconductor film, including the steps of forming a transparent conductive film, forming a first conductive film over the transparent conductive film, forming a second conductive film over the first conductive film, etching the second conductive film with a gas including chlorine, and etching the first conductive film with a gas including fluorine. During etching of the second conductive film with a gas including chlorine, the transparent conductive film is protected by the first conductive film. During etching of the first conductive film with the gas including fluorine, the transparent conductive film does not react with the gas including fluorine. Therefore, no particle is formed.


Find Patent Forward Citations

Ishizuka, Akihiro. (2009). Method for manufacturing semiconductor device (U.S. Patent No. 7563658). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7563658

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