The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2009

Filed:

Dec. 21, 2006
Applicants:

Shu-luan Chan, Zhongli, TW;

Chi-chih Huang, Taipei, TW;

Shuo-hsun Chang, Zhongli, TW;

Inventors:

Shu-Luan Chan, Zhongli, TW;

Chi-Chih Huang, Taipei, TW;

Shuo-Hsun Chang, Zhongli, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask; herein the core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top surface. The interconnection portion is disposed on the top surface; herein the interconnection portion includes a surface dielectric layer and a surface circuit layer disposed thereon. The surface circuit layer is electrically connected to the circuit pattern, and the surface dielectric layer includes at least a hole that is not covered with the surface circuit layer. The solder mask is disposed on the interconnection portion; herein the solder mask includes an indentation disposed above the hole. In addition, a method for manufacturing the substrate structure is disclosed.


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