The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Jul. 28, 2006
Moo-yong Park, Yongin-si, KR;
Tai-hyoung Kim, Yongin-si, KR;
Choon-goang Kim, Hwaseong-si, KR;
Dong-il Kim, Yongin-si, KR;
Moo-yong Park, Yongin-si, KR;
Tai-hyoung Kim, Yongin-si, KR;
Choon-goang Kim, Hwaseong-si, KR;
Dong-Il Kim, Yongin-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.