The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2009

Filed:

Apr. 25, 2006
Applicants:

Liu Huang, Singapore, SG;

John Sudijono, Singapore, SG;

Koh Yee Wee, Johor, MY;

Inventors:

Liu Huang, Singapore, SG;

John Sudijono, Singapore, SG;

Koh Yee Wee, Johor, MY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01);
U.S. Cl.
CPC ...
Abstract

A dual damascene structure comprising a composite barrier/etch stop layer including a lower silicon carbide (SiC) layer and an upper first oxygen doped SiC layer formed over a substrate is provided. A first dielectric layer is formed over the first oxygen doped SiC layer followed by a second oxygen doped SiC etch stop layer, and a second dielectric layer. An opening with a via and an overlying trench extends through the second dielectric layer, the second oxygen doped SiC etch stop layer, the first dielectric layer, the upper first oxygen doped SiC layer and at least a portion of the lower silicon carbide (SiC) layer. The opening is filled with a diffusion barrier layer and a metal layer.


Find Patent Forward Citations

Huang, Liu. (2009). Composite barrier/etch stop layer comprising oxygen doped sic and sic for interconnect structures (U.S. Patent No. 7538353). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7538353

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…