The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2009
Filed:
Nov. 27, 2006
Takashi Kariya, Ibi-gun, JP;
Toshiki Furutani, Ibi-gun, JP;
Hirofumi Goto, Tokyo, JP;
Shin-ichiro Iwanaga, Tokyo, JP;
Takashi Kariya, Ibi-gun, JP;
Toshiki Furutani, Ibi-gun, JP;
Hirofumi Goto, Tokyo, JP;
Shin-ichiro Iwanaga, Tokyo, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
JSR Corporation, Tokyo, JP;
Abstract
A multilayer printed wiring board is equipped with a core board, a build-up layerformed on the core boardso as to have a conductor patternon the upper surface thereof, a low-elasticity layerformed on the build-up layer, landsthat are provided on the upper surface of the low-elasticity layerand connected to an IC chipvia solder bumps, and conductor poststhat penetrate through the low-elasticity layerand electrically connect the landsto the conductor pattern. The low-elasticity layeris formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.