The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Aug. 24, 2006
Seiichi Nakamura, Tokyo, JP;
Hideki Nishihata, Tokyo, JP;
Riyuusuke Kasamatsu, Tokyo, JP;
Kazunori Tsubuku, Hitachi, JP;
Akira Bando, Hitachi, JP;
Nobuo Tsumaki, Ushiku, JP;
Tomoji Watanabe, Tsuchiura, JP;
Kazuo Mera, Hitachi, JP;
Tsuneo Hayashi, Naka, JP;
Yoichi Kurosawa, Hitachi, JP;
Seiichi Nakamura, Tokyo, JP;
Hideki Nishihata, Tokyo, JP;
Riyuusuke Kasamatsu, Tokyo, JP;
Kazunori Tsubuku, Hitachi, JP;
Akira Bando, Hitachi, JP;
Nobuo Tsumaki, Ushiku, JP;
Tomoji Watanabe, Tsuchiura, JP;
Kazuo Mera, Hitachi, JP;
Tsuneo Hayashi, Naka, JP;
Yoichi Kurosawa, Hitachi, JP;
Sumco Corporation, Tokyo, JP;
Abstract
This apparatus for manufacturing semiconductor substrates has support disks and holding units holding semiconductor substrates on the support disks. The holding unit has a stopper which is formed of a conductive material and holds the brim of the semiconductor substrate, a stopper holder which supports the stopper at the outer circumferential portion thereof, a retaining member which retains the stopper to the support disk, and a heating unit which heats the stopper.