The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2009
Filed:
Nov. 07, 2005
Min LI, Fremont, CA (US);
Kunliang Zhang, Fremont, CA (US);
Masashi Sano, Nagano, JP;
Koichi Terunuma, Nagano, JP;
Simon Liao, Fremont, CA (US);
Kochan Ju, Monte Sereno, CA (US);
Min Li, Fremont, CA (US);
Kunliang Zhang, Fremont, CA (US);
Masashi Sano, Nagano, JP;
Koichi Terunuma, Nagano, JP;
Simon Liao, Fremont, CA (US);
Kochan Ju, Monte Sereno, CA (US);
Headway Technologies, Inc., Milpitas, CA (US);
Abstract
It has been found that the insertion of a copper laminate within CoFe, or a CoFe/NiFe composite, leads to higher values of CPP GMR and DRA. However, this type of structure exhibits very negative magnetostriction, in the range of high −10to −10. This problem has been overcome by giving the copper laminates an oxygen exposure treatment When this is done, the free layer is found to have a very low positive magnetostriction constant. Additionally, the value of the magnetostriction constant can be adjusted by varying the thickness of the free layer and/or the position and number of the oxygen treated copper laminates.