The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Apr. 04, 2007
Yi-chen Huang, Hsinchu, TW;
Chien-chung Fu, Sanchong, TW;
Ming-hong Hsieh, Bade, TW;
Hui Ouyang, Hsinchu, TW;
Yi-nien Su, Kaohsiung, TW;
Hun-jan Tao, HsinChu, TW;
Yi-Chen Huang, Hsinchu, TW;
Chien-Chung Fu, Sanchong, TW;
Ming-Hong Hsieh, Bade, TW;
Hui Ouyang, Hsinchu, TW;
Yi-Nien Su, Kaohsiung, TW;
Hun-Jan Tao, HsinChu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Via hole and trench structures and fabrication methods are disclosed. The structure includes a conductive layer in a dielectric layer, and a via structure in the dielectric layer contacting a portion of a surface of the conductive layer. The via structure includes the conductive liner contacting the portion of the surface of the first conductive layer. A trench structure is formed on the via structure in the dielectric without the conductive liner layer in the trench.