The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2008
Filed:
Sep. 27, 2005
Applicants:
Wen-tsai Su, Miaoli Hsien, TW;
Chin-chi Shen, Hsinchu, TW;
Ming-jer Chiu, Hsinchu, TW;
Chih-chiang Chen, Ilan Hsien, TW;
Inventors:
Wen-Tsai Su, Miaoli Hsien, TW;
Chin-Chi Shen, Hsinchu, TW;
Ming-Jer Chiu, Hsinchu, TW;
Chih-Chiang Chen, Ilan Hsien, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
Bond pad structures are presented. Some embodiments of the structure include a conductive conductor-insulator layer overlying a substrate. The conductive conductor-insulator layer includes a composite region having a conductor sub-region and insulator sub-region, which neighbor each other, and a single material region. The insulator is harder than the conductor.