The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2008
Filed:
Jan. 11, 2005
Cheng-yi Liu, Jhong-Li, TW;
Johanna Swan, Scottsdale, AZ (US);
Anna George, Legal Representative, Phoenix, AZ (US);
Chuan HU, Chandler, AZ (US);
Cheng-Yi Liu, Jhong-Li, TW;
Johanna Swan, Scottsdale, AZ (US);
Anna George, legal representative, Phoenix, AZ (US);
Chuan Hu, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.