The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2008
Filed:
Jan. 05, 2006
Yuzhuo LI, Potsdam, NY (US);
Kwok Tang, Mississauga, CA;
Wu LI, Brampton, CA;
Guomin Bian, Toronto, CA;
Krishnayya Cheemalapati, Potsdam, NY (US);
Vivek Duvvuru, Potsdam, NY (US);
Deenesh Bundi, Boise, ID (US);
Henry Bian, Toronto, CA;
Yuzhuo Li, Potsdam, NY (US);
Kwok Tang, Mississauga, CA;
Wu Li, Brampton, CA;
Guomin Bian, Toronto, CA;
Krishnayya Cheemalapati, Potsdam, NY (US);
Vivek Duvvuru, Potsdam, NY (US);
Deenesh Bundi, Boise, ID (US);
Henry Bian, Toronto, CA;
Dynea Chemicals Oy, Helsinki, FI;
Abstract
An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.