Potsdam, NY, United States of America

Vivek Duvvuru


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Innovator Vivek Duvvuru: Pioneering Advances in Chemical Mechanical Planarization

Introduction

Vivek Duvvuru, based in Potsdam, NY, has made significant contributions to the field of semiconductor manufacturing through his innovative work on chemical mechanical planarization (CMP). With one patented invention under his name, Duvvuru is paving the way for advancements in polishing compositions that enhance semiconductor processing.

Latest Patents

Duvvuru's notable patent, titled "Engineered Non-Polymeric Organic Particles for Chemical Mechanical Planarization," details an abrasive composition comprised of composite non-polymeric organic particles. This invention specifically caters to CMP applications in the semiconductor industry. The patent focuses on creating a slurry composition that is simplified by incorporating various components into the abrasive particles. This innovative approach offers an efficient polishing rate, excellent selectivity, and superior surface quality, making it a valuable addition to CMP practices.

Career Highlights

Currently, Vivek Duvvuru is employed at Dynea Chemicals Oy, a company renowned for its expertise in chemical solutions. His work has positioned him as a knowledgeable figure in the materials science domain, especially concerning the development of advanced polishing materials for semiconductor applications.

Collaborations

Duvvuru collaborates with distinguished colleagues, including Yuzhuo Li and Kwok Tang. Their combined expertise fosters a collaborative environment that enhances the research and development initiatives at Dynea Chemicals Oy, contributing to innovative breakthroughs in the field.

Conclusion

Vivek Duvvuru's work exemplifies the crucial role of inventors in advancing technology within the semiconductor industry. His patent on engineered abrasive particles not only reflects significant innovation but also underscores the ongoing evolution of materials used in CMP applications. As the semiconductor landscape continues to grow, contributions from inventors like Duvvuru will be integral to future advancements.

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