The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Jan. 30, 2007
Muriel Martinez, St. Egreve, FR;
Thierry Barge, Grenoble, FR;
Alain Soubie, St. Egreve, FR;
Chrystelle Lagahe-blanchard, St. Joseph de Riviere, FR;
Cécile Berne, Grenoble, FR;
Olivier Rayssac, Grenoble, FR;
Muriel Martinez, St. Egreve, FR;
Thierry Barge, Grenoble, FR;
Alain Soubie, St. Egreve, FR;
Chrystelle Lagahe-Blanchard, St. Joseph de Riviere, FR;
Cécile Berne, Grenoble, FR;
Olivier Rayssac, Grenoble, FR;
S.O.I.Tec Silicon on Insulator Technologies, Bernin, FR;
Abstract
An automatic high-precision layer cutting device for separating a layer from a semiconductor substrate. The device includes a fixed positioning member for receiving at least a portion of a semiconductor substrate that has a weakened area therein and a peripheral annular notch located below the weakened area. The positioning member maintains the position of the substrate on a moveable support. A cutting mechanism having at least one blade is provided for contacting the substrate and inducing a cleaving wave therein. The cutting mechanism is operatively associated with the positioning member so that the as at least one blade contacts the annular notch, the positioning member prevents movement of the substrate and the moveable support moves away from the substrate to allow the cleaving wave to both divide the substrate at the notch into first and second parts and detach the layer from the substrate along the weakened area.