The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2008

Filed:

Jun. 21, 2006
Applicants:

Daniel Delprat, Crolles, FR;

Eric Neyret, Sassenage, FR;

Oleg Kononchuk, Grenoble, FR;

Patrick Reynaud, Saint Martin d'Here, FR;

Michael Stinco, Voiron, FR;

Inventors:

Daniel Delprat, Crolles, FR;

Eric Neyret, Sassenage, FR;

Oleg Kononchuk, Grenoble, FR;

Patrick Reynaud, Saint Martin d'Here, FR;

Michael Stinco, Voiron, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

This invention provides methods for manufacturing compound-material wafers and methods for recycling donor substrates that results from manufacturing compound-material wafers. The provided methods includes at least one further thermal treatment step configured to at least partially reduce oxygen precipitates and/or nuclei. Reduction of oxygen precipitates and/or nuclei, improves the recycling rate of the donor substrate.


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