The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2008
Filed:
Mar. 16, 2005
Mauro J. Kobrinsky, Portland, OR (US);
Jun He, Portland, OR (US);
Kevin O'brien, Portland, OR (US);
Patrick Morrow, Portland, OR (US);
Ying Zhou, Tigard, OR (US);
Shriram Ramanathan, Portland, OR (US);
Mauro J. Kobrinsky, Portland, OR (US);
Jun He, Portland, OR (US);
Kevin O'Brien, Portland, OR (US);
Patrick Morrow, Portland, OR (US);
Ying Zhou, Tigard, OR (US);
Shriram Ramanathan, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A method of forming self-passivating interconnects. At least one of two mating bond structures is formed, at least in part, from an alloy of a first metal and a second metal (or other element). The second metal is capable of migrating through the first metal to free surfaces of the mating bond structures. During bonding, the two mating bond structures are bonded together to form an interconnect, and the second metal segregates to free surfaces of this interconnect to form a passivation layer. Other embodiments are described and claimed.