The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2008
Filed:
Jul. 21, 2006
IL Kwon Shim, Singapore, SG;
Diane Sahakian, Tempe, AZ (US);
Kambhampati Ramakrishna, Chandler, AZ (US);
Seng Guan Chow, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Diane Sahakian, Tempe, AZ (US);
Kambhampati Ramakrishna, Chandler, AZ (US);
Seng Guan Chow, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacturing a pre-molded leadframe for use in a semiconductor package includes providing a leadframe having a die pad and a plurality of leads. A first molding material is formed in the leadframe to expose the upper surface of the die pad and the upper surfaces of the plurality of leads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile