The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Oct. 28, 2005
Chiu-ming Chou, Kao-hsiung, TW;
Chien-kang Chou, Tainan Hsien, TW;
Ching-san Lin, Wufong Township, Taichung County, TW;
Mou-shiung Lin, Hsinchu, TW;
Hsin-jung Lo, Jhonghe, TW;
Chiu-Ming Chou, Kao-hsiung, TW;
Chien-Kang Chou, Tainan Hsien, TW;
Ching-San Lin, Wufong Township, Taichung County, TW;
Mou-Shiung Lin, Hsinchu, TW;
Hsin-Jung Lo, Jhonghe, TW;
Megica Corporation, Hsin-Chu, TW;
Abstract
The invention provides a semiconductor chip comprising an interconnecting structure over said passivation layer. The interconnecting structure comprises a first contact pad connected to a second contact pad exposed by an opening in a passivation layer. A metal bump is on the first contact pad and over multiple semiconductor devices, wherein the metal bump has more than 50 percent by weight of gold and has a height of between 8 and 50 microns.