The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2008
Filed:
Aug. 05, 2005
Keizo Yamada, Tokyo, JP;
Yousuke Itagaki, Tokyo, JP;
Takeo Ushiki, Tokyo, JP;
Tohru Tsujide, Tokyo, JP;
Keizo Yamada, Tokyo, JP;
Yousuke Itagaki, Tokyo, JP;
Takeo Ushiki, Tokyo, JP;
Tohru Tsujide, Tokyo, JP;
Topcon Corporation, Itabashi-Ku, Tokyo, JP;
Abstract
A system and method is disclosed for obtaining information regarding one or more contact and/or via holes on a semiconductor wafer. In one embodiment, the method obtains information regarding one or more holes (for example, via or contact) that are disposed in a semiconductor wafer or disposed in a layer which is disposed on or above the semiconductor wafer. The method of this embodiment comprises irradiating the one or more holes with an electron beam; and determining information relating to a bottom diameter or a bottom circumference of the one or more holes using data which is representative of an amount of substrate current which is generated in response to irradiating the one or more holes with an electron beam.