The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2008
Filed:
Mar. 17, 2006
Jong-woo Ha, Seoul, KR;
Gwang Kim, Ichon-si, KR;
Juhyun Park, Seoul, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first encapsulation and a second integrated circuit package having a second encapsulation, stacking the first integrated package below the second integrated circuit package with the first encapsulation attached to the second encapsulation, forming a substrate having an opening from a substrate top surface to a substrate bottom surface, mounting the first integrated circuit package over the substrate top surface, electrically connecting the first integrated circuit package and the substrate bottom surface through the opening, and electrically connecting the second integrated circuit package and the substrate top surface.