The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2008
Filed:
Jun. 18, 2004
Fay Hua, San Jose, CA (US);
Thomas J. Fitzgerald, Phoenix, AZ (US);
Carl L. Deppisch, Chandler, AZ (US);
Gregory M. Chrysler, Chandler, AZ (US);
Fay Hua, San Jose, CA (US);
Thomas J. Fitzgerald, Phoenix, AZ (US);
Carl L. Deppisch, Chandler, AZ (US);
Gregory M. Chrysler, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is formed on the metal body. The thermal interface material on the die is brought into contact with the wetting layer of material comprising indium. The thermal interface material is heated to form a bond between the thermal interface material and the wetting layer so that the thermal interface material is coupled to the metal body, and to form a bond between the thermal interface material and the die so that the thermal interface material is coupled to the die.