The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2008

Filed:

Feb. 17, 2006
Applicants:

Kouji Iwasaki, Chiba, JP;

Masanso Munekane, Chiba, JP;

Inventors:

Kouji Iwasaki, Chiba, JP;

Masanso Munekane, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01J 37/305 (2006.01); G01N 1/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sample support of the present invention is prepared such that a silicon substrate is used as a raw material, the thickness structure having a shape and a thickness of 10 μm or less is prepared using a semiconductor silicon process technique. The sample support of the present invention is adhered to a partially-cut mesh in a state that a sample portion is not adhered. Further, a plurality of portions where the samples are mounted is arranged on the same substrate.


Find Patent Forward Citations

Iwasaki, Kouji. (2008). Sample support prepared by semiconductor silicon process technique (U.S. Patent No. 7345289). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7345289

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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