The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2008

Filed:

Aug. 26, 2003
Applicants:

Toshio Yokoyama, Tokyo, JP;

Masahiko Sekimoto, Tokyo, JP;

Akira Ogata, Tokyo, JP;

Hiroaki Inoue, Tokyo, JP;

Seiji Katsuoka, Tokyo, JP;

Inventors:

Toshio Yokoyama, Tokyo, JP;

Masahiko Sekimoto, Tokyo, JP;

Akira Ogata, Tokyo, JP;

Hiroaki Inoue, Tokyo, JP;

Seiji Katsuoka, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A workpiece is processed uniformly, e.g., a uniform plated film is formed on a workpiece, by a processing liquid, e.g., a plating solution, which is maintained in an optimum state while minimizing the amount of the processing liquid to be used. An apparatus for processing the workpiece has a plurality of solution supply tanksfor individually holding a plurality of solutions, respectively, to be mixed into a processing liquidwhile managing the temperatures of the solutions, a plurality of mixing tanksfor mixing the solutions individually supplied from the solution supply tanksinto the processing liquidwhile managing the temperatures of the solutions, and a processing bathfor introducing the processing liquidtherein and processing the workpiece, e.g., a substrate W, by bringing the workpiece into contact with the processing liquidwhile managing the temperature of the processing liquid


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