The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2008
Filed:
Aug. 04, 2005
Feng Q. Liu, San Jose, CA (US);
Tianbao Du, Santa Clara, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Yan Wang, Sunnyvale, CA (US);
Yongqi HU, San Jose, CA (US);
Stan D. Tsai, Fremont, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Wen-chiang Tu, Mountainview, CA (US);
Wei-yung Hsu, Santa Clara, CA (US);
Feng Q. Liu, San Jose, CA (US);
Tianbao Du, Santa Clara, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Yan Wang, Sunnyvale, CA (US);
Yongqi Hu, San Jose, CA (US);
Stan D. Tsai, Fremont, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Wen-Chiang Tu, Mountainview, CA (US);
Wei-Yung Hsu, Santa Clara, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.