The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Oct. 05, 2004
Frank D. Egitto, Binghamton, NY (US);
Donald S. Farquhar, Endicott, NY (US);
Voya R. Markovich, Endwell, NY (US);
Mark D. Poliks, Vestal, NY (US);
Douglas O. Powell, Endicott, NY (US);
Frank D. Egitto, Binghamton, NY (US);
Donald S. Farquhar, Endicott, NY (US);
Voya R. Markovich, Endwell, NY (US);
Mark D. Poliks, Vestal, NY (US);
Douglas O. Powell, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile