The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2007
Filed:
Jul. 31, 2002
Bernd Goller, Otterfing, DE;
Robert Christian Hagen, Sarching, DE;
Gerald Ofner, Bad Abbach, DE;
Christian Stuempfl, Schwandorf, DE;
Josef Thumbs, Breitenbrunn, DE;
Stefan Wein, Lappersdorf, DE;
Holger Woerner, Regensburg, DE;
Bernd Goller, Otterfing, DE;
Robert Christian Hagen, Sarching, DE;
Gerald Ofner, Bad Abbach, DE;
Christian Stuempfl, Schwandorf, DE;
Josef Thumbs, Breitenbrunn, DE;
Stefan Wein, Lappersdorf, DE;
Holger Woerner, Regensburg, DE;
Infineon Technologies AG, Neubiburg, DE;
Abstract
An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.