The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2007
Filed:
Mar. 01, 2006
Joerg Kiesewetter, Sacka, DE;
Axel Schmidt, Stoelpchen, DE;
Stefan Kreissig, Venusberg, DE;
Karsten Stoll, Bautzen, DE;
Ralph Juettner, Dresden, DE;
Hans-juergen Fleischer, Priestewitz, DE;
Joerg Kiesewetter, Sacka, DE;
Axel Schmidt, Stoelpchen, DE;
Stefan Kreissig, Venusberg, DE;
Karsten Stoll, Bautzen, DE;
Ralph Juettner, Dresden, DE;
Hans-Juergen Fleischer, Priestewitz, DE;
Suss Microtec Test Systems GmbH, Sacka, DE;
Abstract
A wafer probe station is provided with a wafer chuck, a wafer fastened on the chuck by vacuum suction, and a probe needle arrangement above the wafer to test the wafer at high frequencies by contacting selected pads on the wafer and alternately pads on a calibration substrate also fastened on the wafer chuck. A procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate uses first and second measurement systems to calculate a new offset position of the calibration substrate after a second wafer is loaded on the wafer chuck. In a last step, the wafer chuck is driven by a 4axis manipulator stage to the new calibration position from the recent position.