The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Aug. 11, 2003
Chie Shishido, Yokohama, JP;
Yuji Takagi, Yokohama, JP;
Shuji Maeda, Yokohama, JP;
Takanori Ninomiya, Hiratsuka, JP;
Takashi Hiroi, Yokohama, JP;
Masahiro Watanabe, Yokohama, JP;
Hideaki Doi, Oota-ku, JP;
Chie Shishido, Yokohama, JP;
Yuji Takagi, Yokohama, JP;
Shuji Maeda, Yokohama, JP;
Takanori Ninomiya, Hiratsuka, JP;
Takashi Hiroi, Yokohama, JP;
Masahiro Watanabe, Yokohama, JP;
Hideaki Doi, Oota-ku, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A pattern inspecting method and apparatus for inspecting a defect or defective candidate of patterns on a sample includes picking up an image of a sample by shifting a sampling position on the sample, measuring geometric distortion in an image of a standard sample, beforehand, and defining a size for which the measured geometric distortion is neglectable, obtaining a first image of the sample and a second image to be compared with the first image, dividing the first image and the second stage into images of a division unit having a size not greater than the defined size, comparing a divided image of the first image with a divided image of the second image, and for calculating a difference in gradation values between both of the divided images. The defect or the defect candidate of the sample is extracted in accordance with the difference in the gradation values.