The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2007
Filed:
Jul. 11, 2003
Itaru Kanno, Hyogo, JP;
Yasuhiro Asaoka, Hyogo, JP;
Masahiko Higashi, Hyogo, JP;
Yoshiharu Hidaka, Osaka, JP;
Etsuro Kishio, Kyoto, JP;
Tetsuo Aoyama, Kanagawa, JP;
Tomoko Suzuki, Kanagawa, JP;
Toshitaka Hiraga, Kanagawa, JP;
Toshihiko Nagai, Kanagawa, JP;
Itaru Kanno, Hyogo, JP;
Yasuhiro Asaoka, Hyogo, JP;
Masahiko Higashi, Hyogo, JP;
Yoshiharu Hidaka, Osaka, JP;
Etsuro Kishio, Kyoto, JP;
Tetsuo Aoyama, Kanagawa, JP;
Tomoko Suzuki, Kanagawa, JP;
Toshitaka Hiraga, Kanagawa, JP;
Toshihiko Nagai, Kanagawa, JP;
Renesas Technology Corp., Tokyo, JP;
Matsushita Electric Industrial Co., Ltd., Kadoma-Shi, Osaka, JP;
EKC Technology K.K., Kawasaki-Shi, Kanagawa, JP;
Abstract
The cleaning composition for removing resists includes a salt of hydrofluoric acid and a base not containing a metal (A component), a water-soluble organic solvent (B1 component), at least one organic acid or inorganic acid (C component), water (D component), and, optionally, an ammonium salt (E1 component), and having a pH-. Thus, in manufacturing a semiconductor device, such as a copper interconnecting process, efficiency of removing resist residue and other etching residue after etching or ashing is improved, and corrosion resistance of a copper and an insulating film is also improved.