The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2007
Filed:
Mar. 18, 2004
Rene George, San Jose, CA (US);
Andreas Kadavanich, Fremont, CA (US);
Daniel J. Devine, Los Gatos, CA (US);
Stephen E. Savas, San Jose, CA (US);
John Zajac, San Jose, CA (US);
Hongching Shan, Cupertino, CA (US);
Rene George, San Jose, CA (US);
Andreas Kadavanich, Fremont, CA (US);
Daniel J. Devine, Los Gatos, CA (US);
Stephen E. Savas, San Jose, CA (US);
John Zajac, San Jose, CA (US);
Hongching Shan, Cupertino, CA (US);
Mattson Technology, Inc., Fremont, CA (US);
Abstract
A more uniform plasma process is implemented for treating a treatment object using an inductively coupled plasma source which produces an asymmetric plasma density pattern at the treatment surface using a slotted electrostatic shield having uniformly spaced-apart slots. The slotted electrostatic shield is modified in a way which compensates for the asymmetric plasma density pattern to provide a modified plasma density pattern at the treatment surface. A more uniform radial plasma process is described in which an electrostatic shield arrangement is configured to replace a given electrostatic shield in a way which provides for producing a modified radial variation characteristic across the treatment surface. The inductively coupled plasma source defines an axis of symmetry and the electrostatic shield arrangement is configured to include a shape that extends through a range of radii relative to the axis of symmetry.