The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2007
Filed:
Aug. 25, 2000
Takeshi Uchida, Ibaraki, JP;
Yasuo Kamigata, Ibaraki, JP;
Hiroki Terasaki, Ibaraki, JP;
Yasushi Kurata, Ibaraki, JP;
Tetsuya Hoshino, Ibaraki, JP;
Akiko Igarashi, Ibaraki, JP;
Takeshi Uchida, Ibaraki, JP;
Yasuo Kamigata, Ibaraki, JP;
Hiroki Terasaki, Ibaraki, JP;
Yasushi Kurata, Ibaraki, JP;
Tetsuya Hoshino, Ibaraki, JP;
Akiko Igarashi, Ibaraki, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
This invention provides a polishing medium for CMP, comprising an oxidizing agent, a metal-oxide-dissolving agent, a protective-film-forming agent, a water-soluble polymer, and water, and a polishing method making use of this polishing medium. Also, it is preferable that the water-soluble polymer has a weight-average molecular weight of 500 or more and the polishing medium has a coefficient of kinetic friction of 0.25 or more, a Ubbelode's viscosity of from 0.95 mPa·s (0.95 cP) to 1.5 mPa·s (1.5 cP) and a point-of-inflection pressure of 5 kPa (50 gf/cm).