The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2007
Filed:
Jun. 29, 2004
Eric G. Webb, Salem, OR (US);
Jonathan D. Reid, Sherwood, OR (US);
John H. Sukamto, Tualatin, OR (US);
Yuichi Takada, Yokohama, JP;
Eric G. Webb, Salem, OR (US);
Jonathan D. Reid, Sherwood, OR (US);
John H. Sukamto, Tualatin, OR (US);
Yuichi Takada, Yokohama, JP;
Novellus Systems, Inc., San Jose, CA (US);
Abstract
An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid precipitation of wetting agent or other solute out of the plating solution. In some embodiments, the wetting agent decreases the air-liquid surface tension of the electroplating solution to 60 dyne/cmor less to increase the wetting ability of the solution with a substrate surface. In some embodiments of a method for plating metal onto substrate surface, the electroplating solution has a measured contact angle with the substrate surface less than 60 degrees.