The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Jul. 08, 2003
Michael X. Yang, Palo Alto, CA (US);
Ming Xi, Palo Alto, CA (US);
Russell C. Ellwanger, San Jun Bautista, CA (US);
Eric B. Britcher, Rancho Cucamonga, CA (US);
Bernardo Donoso, San Jose, CA (US);
Lily L. Pang, Fremont, CA (US);
Svetlana Sherman, San Jose, CA (US);
Henry Ho, San Jose, CA (US);
Anh N. Nguyen, Milpitas, CA (US);
Alexander N. Lerner, San Jose, CA (US);
Allen L. D'ambra, Burlingame, CA (US);
Arulkumar Shanmugasundram, Sunnyvale, CA (US);
Tetsuya Ishikawa, Saratoga, CA (US);
Yevgeniy Rabinovich, Fremont, CA (US);
Dmitry Lubomirsky, Cupertino, CA (US);
Yeuk-fai Edwin Mok, San Francisco, CA (US);
Son T. Nguyen, San Jose, CA (US);
Michael X. Yang, Palo Alto, CA (US);
Ming Xi, Palo Alto, CA (US);
Russell C. Ellwanger, San Jun Bautista, CA (US);
Eric B. Britcher, Rancho Cucamonga, CA (US);
Bernardo Donoso, San Jose, CA (US);
Lily L. Pang, Fremont, CA (US);
Svetlana Sherman, San Jose, CA (US);
Henry Ho, San Jose, CA (US);
Anh N. Nguyen, Milpitas, CA (US);
Alexander N. Lerner, San Jose, CA (US);
Allen L. D'Ambra, Burlingame, CA (US);
Arulkumar Shanmugasundram, Sunnyvale, CA (US);
Tetsuya Ishikawa, Saratoga, CA (US);
Yevgeniy Rabinovich, Fremont, CA (US);
Dmitry Lubomirsky, Cupertino, CA (US);
Yeuk-Fai Edwin Mok, San Francisco, CA (US);
Son T. Nguyen, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.