The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
Aug. 25, 2004
Takehiko Fujita, Tokyo, JP;
Akitake Tamura, Tokyo, JP;
Keisuke Suzuki, Tokyo, JP;
Kazuhide Hasebe, Tokyo, JP;
Mitsuhiro Okada, Tokyo, JP;
Takehiko Fujita, Tokyo, JP;
Akitake Tamura, Tokyo, JP;
Keisuke Suzuki, Tokyo, JP;
Kazuhide Hasebe, Tokyo, JP;
Mitsuhiro Okada, Tokyo, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method for subjecting target substrates to a heat process under a vacuum pressure includes a transfer step, heating-up and pressure-reducing step, and heat-processing step. The transfer step is arranged to transfer into a reaction chamber a holder that supports the substrates at intervals. The heating-up and pressure-reducing step following the transfer step is arranged to heat up the reaction chamber to a process temperature, and exhaust the reaction chamber to a process pressure. During the heating-up and pressure-reducing step, the reaction chamber is set at the process pressure after being set at the process temperature, to form a state where the reaction chamber has the process temperature under a pressure higher than the process pressure. The heat-processing step following the heating-up and pressure-reducing step is arranged to subject the substrates to the heat process at the process temperature and process pressure.