The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2007
Filed:
Mar. 25, 2005
Takashi Imoto, Yokohama, JP;
Chiaki Takubo, Tokyo, JP;
Ryuji Hosokawa, Ebina, JP;
Yoshihisa Imori, Yokohama, JP;
Takao Sato, Tokyo, JP;
Tetsuya Kurosawa, Yokohama, JP;
Mika Kiritani, Kawasaki, JP;
Takashi Imoto, Yokohama, JP;
Chiaki Takubo, Tokyo, JP;
Ryuji Hosokawa, Ebina, JP;
Yoshihisa Imori, Yokohama, JP;
Takao Sato, Tokyo, JP;
Tetsuya Kurosawa, Yokohama, JP;
Mika Kiritani, Kawasaki, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.