For the Inventor, By the Inventor

Enter inventor name

Ryuji Hosokawa

USPTO Granted Patents = 8

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 52(Granted Patents)

Location History:

Yokohama, JP (1996 - 1997)
Zama, JP (2004)
Ebina, JP (2007 - 2009)
Kanagawa, JP (2007 - 2014)

Company Filing History:

8 out of 52,711

Kabushiki Kaisha Toshiba

Years Active: 1996-2014

Loading Chart...

8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8759971 - Semiconductor apparatus (2014-06-24),

2. 7608911 - Semiconductor device package having a semiconductor element with a roughened surface (2009-10-27),

3. 7405159 - Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface (2008-07-29),

4. 7298035 - Semiconductor device and a method of assembling a semiconductor device (2007-11-20),

5. 7202563 - Semiconductor device package having a semiconductor element with resin (2007-04-10),

6. 6734541 - Semiconductor laminated module (2004-05-11),

7. 5614441 - Process of folding a strip leadframe to superpose two leadframes in a (1997-03-25),

8. 5543658 - Method of manufacturing resin-sealed semiconductor device, lead frame (1996-08-06),

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…