The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2007
Filed:
Nov. 07, 2003
Kon-tsu Kin, Hsinchu, TW;
Chiou-mei Chen, Hsinchu, TW;
Jen-chung Lou, Hsinchu, TW;
Ching-yi Hsu, Hsinchu, TW;
Farhang Shadman, Tucson, AZ (US);
Kon-Tsu Kin, Hsinchu, TW;
Chiou-Mei Chen, Hsinchu, TW;
Jen-Chung Lou, Hsinchu, TW;
Ching-Yi Hsu, Hsinchu, TW;
Farhang Shadman, Tucson, AZ (US);
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
The present invention discloses a technique of removing a substance from a substrate surface, such as stripping photoresist from a wafer, or forming a substance on a substrate surface. Substrates to be treated are parallel arranged at an equal interval and are immersed in a liquid with only a lower portion thereof being below the liquid surface. Gas such as ozone is introduced into the liquid and is continuously bubbling below the substrates. The bubbles will ascend between two adjacent substrates and climb on the surfaces of the substrates before they burst. The liquid boundary layers on the substrate surfaces are compressed and refreshed in the course of a dragging ascent of the bubbles, enhancing mass transfer between gas/liquid/solid substances across the liquid boundary layer, thereby resulting in a fast reaction and a fast treatment of the surface of the substrates.