The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
Dec. 19, 2002
Applicants:
Linlin Chen, Plano, TX (US);
Jiong-ping LU, Richardson, TX (US);
Changfeng Xia, Plano, TX (US);
Inventors:
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/48 (2006.01); C25D 7/12 (2006.01); C25D 5/02 (2006.01); C25D 5/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
An improved copper ECD process. After the copper seed layer () is formed, a first portion of copper film () is plated onto the surface of the seed layer (). The surface of the first portion of the copper film () is then rinsed to equalize the organic adsorption on all sites to prevent preferential copper growth in dense areas. After rinsing, the remaining copper of the copper film () is electrochemically deposited.