The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Dec. 16, 2004
Belgacem Haba, Cupertino, CA (US);
Masud Beroz, Livermore, CA (US);
Ronald Green, San Jose, CA (US);
Ilyas Mohammed, Santa Clara, CA (US);
Stuart E. Wilson, Menlo Park, CA (US);
Wael Zohni, San Jose, CA (US);
Yoichi Kubota, Pleasanton, CA (US);
Jesse Burl Thompson, Brentwood, CA (US);
Belgacem Haba, Cupertino, CA (US);
Masud Beroz, Livermore, CA (US);
Ronald Green, San Jose, CA (US);
Ilyas Mohammed, Santa Clara, CA (US);
Stuart E. Wilson, Menlo Park, CA (US);
Wael Zohni, San Jose, CA (US);
Yoichi Kubota, Pleasanton, CA (US);
Jesse Burl Thompson, Brentwood, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.